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double-sided multilayer PCB manufacturer FR4 sheet PCB processing with expedited service available circuit pcb factory

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Guangzhou Highleap Electronic Co.,Ltd.

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double-sided multilayer PCB manufacturer FR4 sheet PCB processing with expedited service available circuit pcb factory

Name: doublesided multilayer PCB manufacturer FR4 sheet PCB processing with expedited service available circuit pcb factory
Brand: HighLeap
Price: 1 USD

Brand Name : HighLeap

Model Number : PCB Board

Certification : ISO9001/Iso14001/CE/ROHS

Place of Origin : China

MOQ : 1pcs

Price : USD 1-30 piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 piece per week

Delivery Time : 1-15 working days

Packaging Details : Vacuum Package

Product name : Printed Circuit Board....

Copper Thickness : 0.5oz-12oz....

Application : Electronics Device....

Surface Finishing : HASL\OSP\immersion Gold\ENIG....

Certificate : CE/ISO/ROHS....

Base Material : FR4+ROGERS/ROGERS+ROGERS...

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double-sided multilayer PCB manufacturer FR4 sheet PCB processing with expedited service available circuit pcb factory

Item	Specification
1	Numbr of Layer	1-18Layers
2	Material	FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
2	Material
3	Surface Finish	HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
4	Finish Board Thickness	0.2mm-6.00 mm(8mil-126mil)
5	Copper Thickness	1/2 oz min;12 oz max
6	Solder Mask	Green/Black/White/Red/Blue/Yellow
7	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
8	Min.Hole Diameter for CNC Driling	0.1mm(4mil)
9	Min.Hole Diameter for punching	0.9mm(35mil)
10	Biggest panel size	610mm*508mm
11	Hole Positon	+/-0.075mm(3mil) CNC Driling
12	Conductor Width(W)	0.05mm(2mil)or; +/-20% of original artwork
13	Hole Diameter(H)	PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil)
14	Outline Tolerance	0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching
15	Warp & Twist	0.70%
16	Insulation Resistance	10Kohm-20Mohm
17	Conductivity	<50ohm
18	Test Voltage	10-300V
19	Panel Size	110×100mm(min);660×600mm(max)
20	Layer-layer misregistration	4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max
21	Min.spacing between hole edge to circuity pqttern of an inner layer	0.25mm(10mil)
22	Min.spacing between board oulineto circuitry pattern of an inner layer	0.25mm(10mil)
23	Board thickness tolerance	4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil)
24	Impedance Control	+/-10%
25	Different Impendance	+-/10%

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